SMD Summary

The SMD Summary action is intended to operate on external copper layers and produce statistical reports on SMD lands and packages in the inspected layers. The SMD pitch and pad size parameters, as well as the types and numbers of packages, are important factors in the manufacturability and testability of PCBs.

The SMD summary action uses the inspected outer layers as well as associated solder mask layers to determine the SMD lands and packages statistics, and solderability parameters such as stripe and annular ring. It also check annular rings and stripes measurements, size of SMD row, if SMD rows fit SMD area, if pads are too small and need staggering, or if pitch is non-uniform and other criteria.

Dynamic Categories

The SMD Summary action uses dynamic category names to report annular ring and stripe measurements in conjunction with size and stripe value combinations.

The general structure of a category name is:

 

When v_sort_by_pitch parameter specified as Yes

PITCHxSIZE_STRIPEx<pitch_value>x<size_value> *

Stores all the stripe measurements for a pitch x size combination

PITCHxSIZE_ARx<pitch_value>x<size_value>*

Stores all the SM AR measurements for a pitch x size combination

When v_sort_by_pitch parameter specified as No

 

SIZExPITCH_STRIPEx<size_value>x<pitch_value>*

Stores all the stripe measurements for a size x pitch combination

SIZExPITCH_ARx<size_value>x<pitch_value>*

Stores all the SM AR measurements for a size x pitch combination

An example of a full name is:

PITCHxSIZE_STRIPEx19.0x11.0*

This stores all the stripe measurements for the 19 mil pitch 11 mil pad width SMD rows.

Feature Attributes

Attribute Name

Description

.smd

This attribute should be attached to outer layer pads that are lands for SMD components. It is set by the `Set SMD Attribute' Cleanup action.

 

Result Attributes

 

Result Attribute

<layer_name>_num_smd_row

<layer_name>_num_smd_pack

<layer_name>_num_test_pin_min

<layer_name>_num_test_pin_stagger

<layer_name>_num_non_uniform_pitch

<layer_name>_num_picture_frame

*         Only layer name attributes are created and not total run attributes. Total numbers are meaningless in this context.

Special Reports

The SMD Summary action generates two special reports.

1.      SMD Summary Report lists the manufacturability parameters for every pair of pitch and pad width values, including the following:

2.  Stripes (spacing between adjacent solder mask openings for pads) both min and max values

3.  Annular rings of SMD pads versus their SM clearances

4.  Spacing between adjacent SMD pads

5.      Packages Summary Table lists data regarding SMD packages (components) detected in inspected layers. For each package type detected, the following information is listed:

6.  Number of SMD packages

7.  Number of pads in each package

8.  Number of rows in each package

9.  Minimum and maximum values of the pad widths and lengths

10.                      Pitches of package rows

 

Two sample reports produced for top and bottom layers of an actual board are provided below:

Action : SMD Summary

Layer : bottom

JOB : aman.001

STEP : pcb

DATE : 18 Dec 97

TIME : 08:53:44

Created on GENESIS

*********************************

Action : SMD Summary

Layer : photo_1.ger

SMD Summary

*************

SMD SUMMARY REPORT

All sizes are given in mils.

Pitch |Max Pad| Stripe | Annular ring | Spacing

Size | Size | min | max | min | max |

---------------------------------------------------------

19.0| 11.0| 1.7| 3.0| 2.5| 2.8| 8.0

50.0| 30.0| 14.0| 14.0| 3.0| 3.0| 20.0

70.0| 50.0| 14.0| 14.0| 3.0| 3.0| 20.0

75.0| 45.0| 24.0| 24.0| 3.0| 3.0| 30.0

100.0| 60.0| 34.0| 34.0| 3.0| 3.0| 40.0

SMD PACKAGES

Layer photo_1.ger

Num of |Rows in| Pad Width | Pad Length |Pitch | Num of Pads

Packages|Package| min | max | min | max | Size | in Package

-----------------------------------------------------------------

1 | 1 |50.0 |50.0 |70.0 |70.0 |70.0 | 6

1 | 1 |30.0 |30.0 |50.0 |50.0 |50.0 | 8

1 | 1 |35.0 |35.0 |45.0 |45.0 |75.0 | 16

1 | 1 |46.0 |46.0 |60.0 |60.0 |100.0 | 16

1 | 1 |46.0 |46.0 |60.0 |60.0 |100.0 | 18

1 | 1 |11.7 |11.7 |50.0 |50.0 |19.7 | 24

1 | 1 |11.7 |11.7 |50.0 |50.0 |19.7 | 25

1 | 1 |11.0 |11.0 |60.0 |60.0 |19.7 | 27

1 | 1 |11.0 |11.0 |60.0 |60.0 |19.7 | 28

1 | 1 |30.0 |30.0 |105.0 |105.0 |50.0 | 30

1 | 1 |11.7 |11.7 |50.0 |50.0 |19.7 | 50

1 | 1 |30.0 |30.0 |105.0 |105.0 |50.0 | 100

SMD PACKAGES

Layer top

# of

Rows in

Pad Width

Pad Length

Pitch

# of pads

Packages

Package

min

max

min

max

size

in package

1

1

40

40

180

180

50.0

49

1

2

105

105

122

122

225.0

6

20

2

16

16

44

44

31.3

8

1

2

30

30

50

50

100.0

8

2

2

24

24

90

90

39.4

64

1

4

16

16

80

80

25.6

160

3

4

11

11

70

70

19.7

208

Layer bottom

# of

Rows in

Pad Width

Pad Length

Pitch

# of pads

Packages

Package

min

max

min

max

size

in package

2

1

45

45

50

50

100.0

6

1

2

40

40

60

60

225.0

6

5

2

45

45

50

50

100.0

8

5

2

16

16

70

70

25.0

48