This chapter introduces the new Analysis action Panel Gold Plating . The action checks that all nets on a PCB that should be gold plated are shorted on the Panel step.
This action requires a new license option: pnlgpck .
To ensure an efficient gold plating process, all nets which are to be gold plated must have a gold-tie connection which leads outside the profile of the PCB. When the PCB is panelized, all of these gold tie connections are then shorted together so they can be placed under current during the gold plating process. Since the connection (of gold ties) is done on the Panel level, there is no way to check the connections on the PCB level.
The analysis is run on the current step (Panel) and checks that all relevant nets of each PCB are connected on the current (Panel) step by touching copper on the Panel step.
There are two ways to define a gold plated layer net: