Purpose |
A copper sliver may cause material to be detached during the photo-imaging processes in fabrication. Floating pieces may cause defects and shorts that reduce yield. |
Function |
Negative layers - reports tiny flakes of
copper (slivers), such as those found between a clearance and a segmentation
line in a negative split plane layer. Measurement included if the sliver
width is less than the pp_sliver action
parameter. Positive layers - reports lines that have
laminate on both sides and are thinner than the pp_sliver action parameter. Measurements are lines approximating the sliver shape.
Measurement is included if the sliver width is less than the pp_sliver action parameter but
non-zero, and sliver length is greater than the min_sliver_len erf variable. |
Activation |
|
Known Limitations |
In negative layers, slivers between clearances (circular)
and segmentation lines (drawn split plane spacing) are found in only 50% of
the cases. |