Silk Screen Optimization is a read-write DFM action designed to prevent silk screen features from encroaching upon exposed signal layer features. All silkscreen layer features are tested against corresponding soldermask layer and drill layer features. Offending features are modified in a manner that:
* Eliminates parts of silk
screen from exposed and drilled outer layer areas.
*
Keeps modified silk
screen features recognizable by making the least possible modifications.
This action operates in three modes:
1. Clipping
-
parts of silk screen lines are clipped where they cross soldermask openings and
drills. As a result, an original line is broken into a series of shorter lines
with spaces to provide requested distance to soldermask and drill features.
2. Merging - a negative mask for
the drill or soldermask feature is added to the silk screen layer to ensure
proper spacing between the silk screen and exposed signal layer and drills.
3. Clip&Merge - a combination of both
of the above methods. Unscratched positive round lines are clipped, and the
rest of the features are merged.
This action operates only on silk screen layers. Relevant solder mask, drill and rout layers can be referenced (if they exist for the processed layer).
*
More than 2
SS layers can be optimized for a step.
Reports total thieving features added to each layer.
Count of measurements for relevant category is reported for each
layer and a grand total is supplied for all layers.
Attribute |
Description |
..._Clipped |
Number of clipped locations |
..._Not_Clipped |
Number of unclipped locations |
..._Not_Clipped_by_SM
|
Number of unclipped locations |
..._Merged |
Number of merged locations |
..._Not_Merged_by_SM
|
Number of unmerged locations |
..._Not_Merged_by_DRL
|
Number of unmerged locations |