Purpose

Provides a review of all identified SMD pads used in the design. It can be used as a measure of the difficulty in producing the job.

Function

Reports matching rows of SMD pads (as described in the SMD Pitch category) and tries to group them into packages. The packages may be composed of two rows, four rows representing a square (QFP) etc. The bounding box representing the package is inserted as a measurement. 

Activation