Purpose

Tiny solder mask slivers may be detached during processing and damage subsequent processes.

Function

Reports thin slivers of solder mask between clearances. Measurement is included if the sliver width is less than the pp_sliver action parameter but non-zero, and sliver length is greater than the min_sliver_len erf variable. Measurements are distance segments between the involved features.

Measurement is included if the sliver width is less than the pp_sliver action parameter but non- zero, and sliver length is greater than the min_sliver_len erf variable. The distance between the measurement segment endpoints along the net should be greater than the sliver width * dist2sliver_ratio when the dist2sliver_ratio is the erf variable.