Purpose

A copper sliver may cause material to be detached during the photo-imaging processes in fabrication.

Floating pieces may cause defects and shorts that reduce yield.

Function

Negative layers - reports tiny flakes of copper (slivers), such as those found between a clearance and a segmentation line in a negative split plane layer. Measurement included if the sliver width is less than the pp_sliver action parameter.

Positive layers - reports lines that have laminate on both sides and are thinner than the pp_sliver action parameter.

Measurements are lines approximating the sliver shape. Measurement is included if the sliver width is less than the pp_sliver action parameter but non-zero, and sliver length is greater than the min_sliver_len erf variable.
The distance between the measurement segment endpoints along the net should be greater than the sliver width * dist2sliver_ratio when dist2sliver_ratio is the erf variable.

Activation

 

Known Limitations

In negative layers, slivers between clearances (circular) and segmentation lines (drawn split plane spacing) are found in only 50% of the cases.