Purpose |
Solder mask layer and external copper layer |
Function |
Reports undrilled pad to solder mask distances less than the pp_ar action parameter. Such a feature could be a testpoint pad, fiducial, non-SMD,
or non-drill pad. Measurements are distance segments corresponding to the
minimal distance between the pad and the clearance outline. |
Activation |
When the ERF variable classify_pad_ar is
set to 1 |
Known Limitations |
If the clearance is drawn, or if the clearance precisely
covers the outer layer pad (1:1), the clearance ID will be r0 . |