Microvia Checks
HDI Drill (Microvia) Analysis
Provides advanced drill analysis for
HDI design. This includes more detailed drill checks with respect to the
special microvia requirements. Signal layer and soldermask-related issues are
checked as well.
Microvia Checks
assumes that the laser drill is drilled from the outermost layer.
Definitions
Drill Type is defined according to the .drill attribute value (PTH, NPTH, Via). If a
hole has no .drill attribute
, the default is PTH for through drills and Via for blind/buried drills. In
addition, vias can be further classified according to the .via_type attribute (Standard/Micro). If a via
hole has no .via_type attribute, the default is
Standard.
Check parameters are computed
implicitly according to the relevant ranges. For example, the maximal PTH to
Via spacing reported is the green value of the category pth2via_spacing .
All spacings are measured edge-to-edge.
Aspect Ratio (diameter-to-depth) is
computed according to the .depth (drill)
layer attribute, which should keep the total board thickness pierced by this
drill layer (the actual drill depth). If not defined, a maximal depth for the
minimal (red) aspect ratio will be reported per drill diameter/type.
Annular Ring/Missing Pad side
(top/bottom) refers to the job matrix and not to the actual drill direction.
Drill-to-copper spacing is reported
only when a drill does not touch copper, and annular ring is reported only when
a drill is fully covered by copper. Otherwise, drill-touches-copper is
reported.
Measurements reported by checks from
the Drill Test list are added to input drill layers. Measurements reported by
checks from Signal and SM Test lists are added to the corresponding Signal/SM
layer.
Tests
Drill Test List
Drill-related checks that can be
applied to drill layers.
*
Spacing - reports spacing between all
drills from the input layer and all drill layers piercing at least one common
board layer (including the input layer itself).
*
Overlap - reports overlap (full or
partial) between all drills from the input layer and all drill layers piercing
at least one common board layer (including the input layer itself).
*
Spatial Spacing - reports spacing between
all drills from the input layer and all drill layers terminating on adjacent
board layers and NOT piercing a common board layer (for blind/buried drills
only).
*
Spatial Overlap - reports overlap
between all drills from the input layer and all drill layers terminating on
adjacent board layers and NOT piercing a common board layer (for blind/buried
drills only).
*
Aspect Ratio - reports aspect ratio
and/or maximum drill depth.
Signal Test List
Signal-related checks that can be
applied to drill layers relative to signal layers pierced by input drill
layers.
*
Annular Ring -
reports annular ring and copper crossed by drill.
*
Copper Spacing - reports
drill-to-copper spacing.
*
Missing Pad -
reports missing pads for drills.
*
Registration -
reports drills misregistered relative to pads.
SM Test List
Soldermask-related checks that can be
applied to drill layers. Top/bottom soldermask layers will be checked only if
the input drill layer pierces a top/bottom board layer. (Genesis assumes that soldermask
layers are outer layers.)
*
Annular Ring - reports annular ring and soldermask
crossed by drill.
*
Coverage - reports drill-to-soldermask spacing.
*
Covered Drills - reports covered drills.
Attributes
Attribute
|
Description
|
...min_X2Y_spacing
|
minimal
spacing between drills (X and Y are one of PTH,
NPTH, Via, Microvia)
|
...typ_X2Y_spacing
|
typical spacing between drills (X and Y are one of PTH,
NPTH, Via, Microvia)
|
...num_X2Y_overlap
|
number of
overlaps between drills (X and Y are one of PTH,
NPTH, Via, Microvia)
|
...min_X2Y_spatial_spacing
|
minimal
spatial spacing between drills (X and Y are one
of PTH, Via, Microvia)
|
...typ_X2Y_spatial_spacing
|
typical
spatial spacing between drills (X and Y are one of
PTH, Via, Microvia)
|
...num_X2Y_spatial_overlap
|
number of
spatial overlaps between drills (X and Y are one of
PTH, Via, Microvia)
|
...min_X_Y_ar
|
minimal signal
annular ring (X is one of PTH, Via, Microvia, Y is
one of top, bottom, inner)
|
...typ_X_Y_ar
|
typical signal
annular ring (X is one of PTH, Via, Microvia, Y is
one of top, bottom, inner)
|
...min_npth_ar
|
minimal signal
annular ring for NPTH
|
...typ_npth_ar
|
typical signal
annular ring for NPTH
|
...min_X2cu_spacing
|
minimal drill to
copper spacing on signal layer (X is one of PTH,
NPTH, Via, Microvia)
|
...typ_X2cu_spacing
|
typical drill
to copper spacing on signal layer
(X is one of PTH, NPTH, Via, Microvia)
|
...num_X_missing_Y_pad
|
number of
drills with no pads on the corresponding signal layer
(X is one of
PTH, Via, Microvia; Y is one of top, bottom, inner)
|
...num_npth_missing_pad
|
number of
NPTHs with no pads on signal layer
|
...num_X_crosses_cu
|
number of
drills crossing copper (X is one of PTH, NPTH, Via, Microvia)
|
...min_X_reg
|
minimal drill
misregistration relative to the signal layer (X is
one of PTH, NPTH, Via, Microvia)
|
...typ_X_reg
|
typical drill
misregistration relative to the signal layer (X is one
of PTH, NPTH, Via, Microvia)
|
...min_X_sm_ar
|
minimal
soldermask annular ring (X is one of PTH, Via,
Microvia)
|
...typ_X_sm_ar
|
typical
soldermask annular ring (X is one of PTH, Via, Microvia)
|
...num_X_crosses_sm
|
number of drills crossing soldermask (X is one of PTH, NPTH, Via,
Microvia)
|
...num_X_covered
|
number of
drills covered by soldermask (X is one of PTH, Via, Microvia)
|
...min_X_coverage
|
minimal drill
to soldermask opening spacing on soldermask layer
(X is one of
PTH, NPTH, Via, Microvia)
|
...typ_X_coverage
|
typical drill
to soldermask opening spacing on soldermask layer (X is one of PTH, NPTH,
Via, Microvia)
|
...min_X_aspect_ratio
|
minimal aspect
ratio (X is one of PTH, Via, Microvia)
|
...typ_X_aspect_ratio
|
typical aspect ratio (X is one of PTH, Via, Microvia)
|
...min_X_max_depth
|
minimal max
depth (X is one of PTH, Via, Microvia)
|
|
|
|
Categories
X-to-Y Spacing (Drill Test List / Spacing)-X
and Y are one of: PTH, NPTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X-to-Y Spacing
|
Internal ERF
Name
|
X2Y_spacing
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pads
representing two drills
|
Layers
Displayed
|
Drill layer(s)
|
Picture
|
|
Purpose
|
To ensure
sufficient drill-to-drill spacing on a board layer.
|
Function
|
Report spacing
between all drills from the input layer and all
drill layers piercing at least one common board layer (including the input
layer itself). Max spacing to search is defined by the green range value of
the category.
|
Activation
|
Spacing check
in Drill Test List is selected.
|
Known
Limitations
|
|
X-to-Y Overlap (Drill Test List / Overlap)-X
and Y are one of: PTH, NPTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X-to-Y Overlap
|
Internal ERF
Name
|
X2Y_overlap
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pads
representing two drills
|
Layers
Displayed
|
Drill layer(s)
|
Picture
|
|
Purpose
|
To find overlapping
drills on a board layer.
|
Function
|
Reports
overlaps (full or partial) between all drills from the input layer and all
drill layers piercing at least one common board
layer (including the input layer itself).
|
Activation
|
Overlap check in
Drill Test List is selected.
|
Known
Limitations
|
|
X-to-Y Spatial Spacing (Drill Test List /
Spatial Spacing) - X and Y are one of: PTH,
Via, Microvia ..
Item
|
Details
|
Full Name
|
X-to-Y Spatial
Spacing
|
Internal ERF
Name
|
X2Y_spatial_spacing
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pads
representing two drills
|
Layers
Displayed
|
Drill layer(s)
|
Picture
|
|
Purpose
|
To ensure
sufficient drill-to-drill spacing on adjacent board
layers where the drills terminate.
|
Function
|
Reports
spacing between all drills from the input layer and all drill layers
terminating on adjacent board layers and NOT piercing a common board layer.
Max spacing to search is defined by the green range
value of the category.
|
Activation
|
Spatial
Spacing check in Drill Test List is selected and both drill layers are
blind/buried.
|
Known
Limitations
|
|
X-to-Y Spatial Overlap (Drill Test List /
Spatial Overlap) - X and Y are one of: PTH,
Via, Microvia .
Item
|
Details
|
Full Name
|
X-to-Y Spatial
Overlap
|
Internal ERF
Name
|
X2Y_spatial_overlap
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pads
representing two drills
|
Layers
Displayed
|
Drill layer(s)
|
Picture
|
|
Purpose
|
To find
overlapping drills on adjacent board layers where
the drills terminate.
|
Function
|
Reports
overlaps (full or partial) between all drills from the input layer and all
drill layers terminating on adjacent board layers and NOT piercing a common
board layer.
|
Activation
|
Spatial Overlap check in Drill Test List is selected and both
drill layers are blind/buried.
|
Known
Limitations
|
|
X Aspect Ratio (Drill Test List / Aspect
Ratio) - X is one of: PTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X Aspect Ratio
|
Internal ERF
Name
|
X_aspect_ratio
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Pads
representing drill
|
Layers
Displayed
|
Drill layer
|
Picture
|
|
Purpose
|
To ensure that
the aspect ratio fits the process requirements.
|
Function
|
Reports aspect
ratio for all drills if v_compute_typ_aspect_ratio = yes, and for one drill of each symbol of
the given type if
v_compute_typ_aspect_ratio = no.
|
Activation
|
Aspect Ratio check
in Drill Test List is selected and the .depth attribute is defined for the
drill layer.
|
Known
Limitations
|
|
X Max Depth (Drill Test List / Aspect Ratio)
-X is one of: PTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X Max Depth
|
Internal ERF
Name
|
X_max_depth
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Pads
representing drill
|
Layers
Displayed
|
Drill layer
|
Picture
|
|
Purpose
|
To ensure that
the aspect ratio fits the process requirements.
|
Function
|
Reports max
depth for drill according to the min allowed (red) aspect ratio for all
drills if
v_compute_typ_aspect_ratio =
yes , and for one
drill of each symbol of the given type if
v_compute_typ_aspect_ratio = no.
|
Activation
|
Aspect Ratio check
in Drill Test List is selected and the .depth attribute is not defined for the
drill layer, or
v_always_check_max_depth = yes .
|
Known
Limitations
|
|
X Y Annular Ring (Signal Test
List / Annular Ring) -X is one of PTH, Via, Microvia, Y is one of: Top, Bottom, Inner .
Item
|
Details
|
Full Name
|
X Y Annular
Ring
|
Internal ERF
Name
|
X_Y_ar
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Signal Layer
shape and Pad representing a drill.
|
Layers Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure
sufficient annular ring.
|
Function
|
Reports drills
where the annular ring on the corresponding signal layer is less than the
green range value of the category. The side of the layer (top/bottom/inner) is relative to the drill layer as
defined in the job matrix.
|
Activation
|
Annular Ring
check in Signal Test List is selected.
|
Known
Limitations
|
|
NPTH Annular Ring (Signal Test List / Annular
Ring)
Item
|
Details
|
Full Name
|
NPTH Annular
Ring
|
Internal ERF
Name
|
NPTH_ar
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Signal Layer
shape and Pad representing an NPTH
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure
sufficient annular ring
|
Function
|
Reports
non-plated drills where the annular ring on the
corresponding signal layer is less than the green range value of the
category.
|
Activation
|
Annular Ring check
in Signal Test List is selected.
|
Known
Limitations
|
|
X Crosses Copper (Signal Test List / Annular
Ring -X is one of: PTH, NPTH, Via,
Microvia .
Item
|
Details
|
Full Name
|
X Crosses
Copper
|
Internal ERF
Name
|
X_crosses_cu
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Signal Layer
shape and Pad representing a drill
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To find drills
crossing copper on a signal layer.
|
Function
|
Reports drills
partially covered by copper.
|
Activation
|
Annular Ring
check in Signal Test List is selected.
|
Known
Limitations
|
|
X Missing Y Pad (Signal Test List / Missing
Pad)- X is one of: PTH, Via, Microvia ; Y is
one of: Top, Bottom, Inner .
Item
|
Details
|
Full Name
|
X Missing Y
Pad
|
Internal Name
|
X_missing_Y
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Pad
representing a drill
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure that
drill is covered by pad/copper.
|
Function
|
Reports drills
with no pad in the corresponding signal layer.
If v_require_pad_X = no , only drills which are not covered
by copper will be reported. Also, the value of v_missing_pad_X_mode is considered with respect to the
layer side relative to the drill layer as defined in the job matrix.
|
Activation
|
Missing Pad
check in Signal Test List is selected.
|
Known
Limitations
|
|
NPTH Missing Pad (Signal Test List / Missing Pad)
Item
|
Details
|
Full Name
|
NPTH Missing
Pad
|
Internal ERF
Name
|
npth_missing
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Pad
representing a drill
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure that
drill is covered by pad/copper.
|
Function
|
Reports NPTH
drills with no pad in the corresponding signal layer.
|
Activation
|
Missing Pad
check in Signal Test List is selected and v_check_missing_pad_npth
= yes .
|
Known
Limitations
|
|
X-to-Copper Spacing (Signal Test List /
Copper Spacing) - X is one of: PTH, NPTH,
Via, Microvia .
Item
|
Details
|
Full Name
|
X-to-Copper
Spacing
|
Internal ERF
Name
|
X2cu_spacing
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pad
representing a drill and Signal Layer shape
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure
sufficient spacing from drill to (unconnected) copper.
|
Function
|
Reports drills
close to the copper which do not cover it. Max spacing to search is defined
by the green range value of the category.
If v_report_all_spacings = yes , then all spacing violations (less
then max) are reported. Otherwise only the smallest spacing violation is
reported.
|
Activation
|
Copper Spacing
check in Signal Test List is selected.
|
Known
Limitations
|
|
X Registration (Signal Test List /
Registration) - X is one of: PTH, NPTH,
Via, Microvia .
Item
|
Details
|
Full Name
|
X Registration
|
Internal ERF
Name
|
X_reg
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pad
representing a drill and Signal Layer pad
|
Layers
Displayed
|
Signal Layer
and Drill layer
|
Picture
|
|
Purpose
|
To ensure drill
registration relative to the corresponding signal layer pad.
|
Function
|
Reports drills
misregistered relative to the corresponding pad in the signal layer (drill
and pad have different centers). Max misregistration to search is defined by the green range value of the
category.
|
Activation
|
Registration
check in Signal Test List is selected.
|
Known
Limitations
|
|
X SM Annular Ring (SMTest List / Annular
Ring) - X is one of: PTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X SM Annular Ring
|
Internal ERF
Name
|
X_sm_ar
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
SM Layer shape
and Pad representing a drill
|
Layers
Displayed
|
SM Layer and
Drill layer
|
Picture
|
|
Purpose
|
To ensure
sufficient annular ring.
|
Function
|
Reports drills
where the annular ring on the corresponding sm
layer is less than the green range value of the category.
|
Activation
|
Annular Ring
check in SM Test List is selected and the drill layer pierces (at least one)
outer layer.
|
Known
Limitations
|
|
X Crosses SM (SM Test List / Annular Ring) -
X is one of: PTH, NPTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X Crosses SM
|
Internal ERF
Name
|
X_crosses_sm
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
SM Layer shape
and Pad representing a drill
|
Layers
Displayed
|
SM Layer and Drill layer
|
Picture
|
|
Purpose
|
To find drills
crossing solder.
|
Function
|
Reports drills
partially covered by soldermask.
|
Activation
|
Annular Ring
check in SM Test List is selected.
|
Known
Limitations
|
|
Covered X (SM Test List / Covered Drills) - X
is one of: PTH, Via, Microvia .
Item
|
Details
|
Full Name
|
Covered X
|
Internal ERF
Name
|
X_covered
|
Measurement
Shape
|
Circle
|
Measurement
ID(s)
|
Pad
representing a drill
|
Layers
Displayed
|
SM Layer and
Drill layer
|
Picture
|
|
Purpose
|
To ensure that
the drill which pierces the outer layer is exposed
by the corresponding soldermask.
|
Function
|
Reports drills
which are covered by the soldermask (there are no shapes covering the drill
in the corresponding sm layer).
|
Activation
|
Covered Drills
check in SM Test List is selected and the drill
layer pierces (at least one) outer layer.
|
Known
Limitations
|
|
X Coverage (SM Test List / Coverage) - X is
one of: PTH, NPTH, Via, Microvia .
Item
|
Details
|
Full Name
|
X Coverage
|
Internal ERF
Name
|
X_coverage
|
Measurement
Shape
|
Segment
|
Measurement
ID(s)
|
Pad
representing a drill and SM Layer shape
|
Layers
Displayed
|
SM Layer and
Drill layer
|
Picture
|
|
Purpose
|
To ensure
sufficient spacing from drill to the soldermask opening.
|
Function
|
Reports drills
close to the soldermask opening which do not expose
that drill. Max spacing to search is defined by the green range value of the
category.
If v_report_all_coverages=yes , then all spacing violations (less
then max) are reported. Otherwise only the smallest spacing violation is
reported.
|
Activation
|
Copper Spacing
check in Signal Test List is selected.
|
Known
Limitations
|
|