Purpose |
Tiny solder mask slivers may be detached during processing and damage subsequent processes. |
Function |
Reports thin slivers of solder mask between clearances.
Measurement is included if the sliver width is less than the pp_sliver
action parameter but non-zero, and sliver length is greater than the min_sliver_len
erf variable. Measurements are distance segments between the involved
features. Measurement is included if the sliver width is less than
the pp_sliver action parameter but non- zero, and sliver length
is greater than the min_sliver_len erf variable. The
distance between the measurement segment endpoints along the net should be
greater than the sliver width * dist2sliver_ratio
when the dist2sliver_ratio is the erf variable. |