This DFM action
optimizes the coverlay layer by making minor modifications in the
copper layer and in the coverlay layer itself. This reduces the amount
of manual work required for generating coverlay layers.
Result
Attributes
None
Known
Limitations
Coverlay spacing
problems are reported but not optimized in the current version.
The action fails
with "error exit" while trying to create Coverlay (in case of "use
existing" = no) for Special symbols.
The action cannot
optimize or change rectangles to slots in rotated SMDs.