Purpose

Solder mask layer and external copper layer

 

Function

Reports undrilled pad to solder mask distances less than the pp_ar action parameter.

Such a feature could be a testpoint pad, fiducial, non-SMD, or non-drill pad.

Measurements are distance segments corresponding to the minimal distance between the pad and the clearance outline.

Activation

When the ERF variable classify_pad_ar is set to 1

Known Limitations

If the clearance is drawn, or if the clearance precisely covers the outer layer pad (1:1), the clearance ID will be r0 .