Function |
Reports matching rows of SMD pads (as described in the SMD Pitch category above) and tries to group them into packages. The packages may be composed of two rows, four rows representing a square (QFP) etc. The bounding box representing the package is inserted as a measurement. |
Activation |
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Known Limitations |
The packages that are found may not correspond to actual
packages. One reason may be that the pads of discrete components may be
grouped together in a larger package. To ensure you have full component
information, read in CAD data. |