Silk Screen Optimization

Silk Screen Optimization is a read-write DFM action designed to prevent silk screen features from encroaching upon exposed signal layer features. All silkscreen layer features are tested against corresponding soldermask layer and drill layer features. Offending features are modified in a manner that:

*         Eliminates parts of silk screen from exposed and drilled outer layer areas.

*          Keeps modified silk screen features recognizable by making the least possible modifications.

This action operates in three modes:

1.      Clipping - parts of silk screen lines are clipped where they cross soldermask openings and drills. As a result, an original line is broken into a series of shorter lines with spaces to provide requested distance to soldermask and drill features.

2.      Merging - a negative mask for the drill or soldermask feature is added to the silk screen layer to ensure proper spacing between the silk screen and exposed signal layer and drills.

3.      Clip&Merge - a combination of both of the above methods. Unscratched positive round lines are clipped, and the rest of the features are merged.

This action operates only on silk screen layers. Relevant solder mask, drill and rout layers can be referenced (if they exist for the processed layer).

*         More than 2 SS layers can be optimized for a step.

 

Special Reports

Reports total thieving features added to each layer.

Result Attributes

Count of measurements for relevant category is reported for each layer and a grand total is supplied for all layers.

Attribute

Description

..._Clipped

Number of clipped locations

..._Not_Clipped

Number of unclipped locations

..._Not_Clipped_by_SM

Number of unclipped locations

..._Merged

Number of merged locations

..._Not_Merged_by_SM

Number of unmerged locations

..._Not_Merged_by_DRL

Number of unmerged locations